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July 20, 2023 - Master Bond Supreme 3DM-85 is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally...
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May 2, 2023 - Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance. EP5LTE-100 passes NASA low outgassing specifications. It...
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April 19, 2023 - Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. EP17HTDA-2 has exceptional temperature resistance with a service temperature range of -80°F to +600°F [-62°C to +316°C] and a...
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March 16, 2023 - Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat and adheres well to both similar and dissimilar substrates. “Conventional light curing adhesives do not allow light penetration...
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February 9, 2023 - Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications. This epoxy was tested against many sterilization methods, such as autoclaving, STERRAD®, Cidex® and Steris®, successfully resisting a...
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January 6, 2023 - Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to 450°F (232°C), and provides a glass transition temperature (Tg) of 130-135°C. The material meets NASA low outgassing standards and is recommended for applications that require vacuum compatibility. Supreme 42HT-2ND Black is electrically insulative with a volume resistivity greater than 1014 ohm-cm. This...
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November 15, 2022 - Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post-cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many...
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October 14, 2022 - Master Bond MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, optoelectronic and specialty OEM industries. This system has a thermal conductivity of 1.15-1.30 W/(m•K). It is highly...
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September 8, 2022 - Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for non-cytotoxicity. This product cures at moderate temperatures of around 80-85°C within 60 to 90 minutes and faster at slightly higher temperatures. As a one part, non-premixed and frozen system, it contains no solvents and has an “unlimited” working life at room temperature. Suitable...
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August 2, 2022 - Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation of 80-90% at 75°F. It adheres well to many plastics, such as polycarbonates and acrylics, making it appropriate for applications that use substrates prone to stress cracking. This flexible system provides a low tensile...
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